IEEE Journal of Selected Topics in Quantum Electronics 20, 405-416 (2014). Review of silicon photonics foundry efforts. Biophotonic sensors with integrated Si 3N 4-organic hybrid (SiNOH) lasers for point-of-care diagnostics. Integrated phase-sensitive photonic sensors: a system design tutorial. Optical biosensors based on silicon-on-insulator ring resonators: a review. Last advances in silicon-based optical biosensors. Mid-infrared absorption gas sensing using a silicon strip waveguide. Massively parallel coherent laser ranging using a soliton microcomb. Ultrafast optical ranging using microresonator soliton frequency combs. A universal 3D imaging sensor on a silicon photonics platform. THz-to-optical conversion in wireless communications using an ultra-broadband plasmonic modulator. Silicon–plasmonic integrated circuits for terahertz signal generation and coherent detection. Silicon photonic devices and integrated circuits. Supplementary Information for 3D-printed facet-attached microlenses for advanced photonic system assembly.pdfÄong, P.Based on our results, we believe that the FaML concept opens an attractive path towards novel PIC-based system architectures that combine the distinct advantages of different photonic integration platforms. We show the viability and the versatility of the scheme in a series of selected experiments of high technical relevance, comprising pluggable fiber-chip interfaces, the combination of PIC with discrete micro-optical elements such as polarization beam splitters, as well as coupling with ultra-low back-reflection based on non-planar beam paths that only comprise tilted optical surfaces. Moreover, the FaML concept allows to insert discrete optical elements such as optical isolators into the free-space beam paths between PIC facets. Specifically, the emitted beams can be collimated to a comparatively large diameter that is independent of the device-specific mode fields, thereby relaxing both axial and lateral alignment tolerances. FaML can be printed with high precision to the facets of optical components using multi-photon lithography, thereby offering the possibility to shape the emitted beams by freely designed refractive or reflective surfaces. In this paper, we demonstrate that 3D-printed facet-attached microlenses (FaML) can overcome this problem by opening an attractive path towards highly scalable photonic system assembly, relying entirely on passive assembly techniques based on industry-standard machine vision and/or simple mechanical stops. This unavoidably leads to technically complex assembly processes and high cost, thereby eliminating most of the inherent scalability advantages of PIC-based solutions. Specifically, chip-to-chip and fiber-to-chip connections often rely on so-called active alignment techniques, where the coupling efficiency is continuously measured and optimized during the assembly process. However, scalable photonic packaging and system assembly still represents a major challenge that often hinders commercial adoption of PIC-based solutions. Wafer-level mass production of photonic integrated circuits (PIC) has become a technological mainstay in the field of optics and photonics, enabling many novel and disrupting a wide range of existing applications.
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